Reconfigurable Intelligent Surface (RIS) is one of the most promising and revolutionary enabling technologies for the sixth-generation mobile communication system (6G). RISs provide a powerful tool to manipulate electromagnetic waves flexibly and construct intelligent wireless environment, which are expected to enhance the performance of wireless communication systems in a low-cost, low-power manner; thus, RISs attract extensive attention from both academia and industry. To overcome the random and uncontrollable characteristics of the traditional wireless channel and enable active modulation of the channel properties, it is urgent to speed up the evolution and innovation in the fundamental theory, design technique, system architecture, and algorithm optimization of RISs, so as to accelerate industrial application and commercialization process and provide new route for future wireless communication systems.
To maintain an advantage in research, standardization, and industry competition in the RIS area, and to provide important results in theoretical and application studies for future wireless communication, Frontiers of Information Technology & Electronic Engineering (FITEE) launches a special feature of “RIS System Implementation and Applications to Wireless Communications.” Prof. Tiejun Cui, an academician of the Chinese Academy of Sciences, is invited to serve as the Chief Editor. We call for papers on the following topics (but not limited to):
- Physical and Electromagnetic Modeling of RIS
- RIS Architectures and Interfaces
- Channel Measurement and Modeling of RIS
- Integration of RIS-Enabled Communication and Sensing
- Fundamental Theory for RIS-Enabled Wireless Communication
- Transmission Scheme and Optimization for RIS-Enabled Wireless Communication
- Prototype Implementation and Measurement for RIS-Enabled Wireless Communication
Editorial Board
Prof. Tiejun Cui, Southeast University, ChinaProf. Shi Jin, Southeast University, ChinaProf. Qiang Cheng, Southeast University, ChinaEditors (in alphabetical order by last name):Prof. Qammer Abbasi, University of Glasgow, UKProf. Linglong Dai, Tsinghua University, ChinaProf. Marco Di Renzo, Paris-Saclay University, FrenchProf. Vincenzo Galdi, University of Sannio, ItalyProf. Yue Gao, Fudan University, ChinaProf. Lianlin Li, Beijing University, ChinaProf. Long Li, Xidian University, ChinaProf. Jianhua Zhang, Beijing University of Posts and Telecommunications, ChinaProf. Jun Zhang, The Hong Kong University of Science and Technology, ChinaAll submitted manuscripts must be written in English and must not be under consideration elsewhere for publication. Guidelines for authors are available at http://www.jzus.zju.edu.cn/manuscript.php. Either Word or LaTeX format is acceptable. When Word is used, the layout of the text should be in single column, 1.5 lines spacing, 10.5 pt font size, and Times New Roman font. A template is available at http://www.jzus.zju.edu.cn/download/FITEE_LaTex_template.zip. Manuscripts should be submitted via http://www.editorialmanager.com/zusc/ under the article type “S.I. - RIS”.
Important Dates
Manuscript submission by Jan. 1, 2023Acceptance notification by Mar. 31, 2023Publication date: May/June, 2023 (online first once accepted)
FITEE is a peer-reviewed journal launched by the Chinese Academy of Engineering (CAE) and Zhejiang University, and co-published by Springer & Zhejiang University Press. It is SCI-E indexed, with an IF of 2.526 (2021 JCR). FITEE aims to publish the latest implementation of applications, principles, and algorithms in the broad area of Electrical and Electronic Engineering. All articles will undergo international peer review and crosscheck processes before they are accepted to ensure high quality.
For inquiries regarding this special issue, please contact:
Prof. Shi Jin, jinshi@seu.edu.cnProf. Qiang Cheng, qiangcheng@seu.edu.cn
Editorial Office, Ziyang Zhai (managing editor), jzus_zzy@zju.edu.cn, +86-571-88273162